We thought we would share some pictures with the BGA reball process.

We are reballing a PS3 RSX to fix the YLOD. First we start by lifting the RSX from the motherboard and cleaning it up,ready to reball.

We soak the pads with leaded solder then clean up the excess with solder wick.

Once clean,we put the RSX into a BGA jig with a stencil to place the solder balls in position ready to melt/flow to the chip.

Once the balls have been positioned with the stencil,they are ready to heat.

Once heated to the chip it is ready to reflow back onto the motherboard

Contact us if you require a reball on your console or any kind of micro soldering requirements